A production line can be ready while a PCB assembly order is still waiting for one connector, a firmware file, or approval of a component substitution. For hardware teams, a useful lead-time commitment starts with a clear definition of what…
Applied Materials is strengthening its position in advanced chip packaging as demand for AI-related semiconductor technologies continues to grow. According to Reuters, the U.S. semiconductor equipment maker plans to increase its stake in Dutch company BE Semiconductor Industries (BESI) from 9% to…
Home » Packaging » ACM Research Targets Panel-level Packaging with Horizontal Plating and Specialized Cleaning ACM Research Inc. is developing wet-processing equipment for wafer-level packaging (WLP) and panel-level packaging (PLP), where substrate flatness, residue removal and process uniformity are becoming more demanding…
Master critical signoff for flawless chiplet integration and performance Learn how to achieve accurate and comprehensive package assembly verification, paving the way for successful chiplet implementation. In this eBook, the fourth and final in the series, we focus on the…
From metallurgy fundamentals to lab-ready specimens: key decisions before purchasing the first machine. Start With the Science: Why Metallurgy Shapes the Lab Before equipment selection, manufacturers can identify their ten most important components, the materials involved and the failure modes…
Published: Oct. 26, 2026 - 15:20:34 German chemicals giant strengthens Korean semiconductor materials hub as AI drives demand for advanced packaging, with new R&D center planned for 2027 SONGDO, Incheon — Inside a tightly controlled factory in Songdo, German chemicals giant Henkel is producing a…
Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies. Here you may search through our archive of News and Magazine articles. GlobalFoundries reaches agreement to establish U.S.-based supply of…
Summary (approx. 100 characters)China's largest semiconductor equipment manufacturer, NAURA, is acquiring a hybrid bonding equipment company for approximately 405 million yuan. Piotech and AMEC are also advancing investments and acquisitions in related technologies, aiming to localize 3D integra Chinese Semiconductor Equipment Manufacturers…
FORT WASHINGTON, PA — Kulicke & Soffa Industries Inc. (NASDAQ: KLIC) has received the 2026 SEMI Award for North America for a semiconductor bonding technology designed to reduce manufacturing complexity and costs as chipmakers pursue denser interconnections for artificial intelligence and high-performance computing.
When Axium Packaging was looking for a place to anchor its future, we weren't simply searching for land or tax incentives. We were looking for an ecosystem where manufacturing, innovation, customers and talent could come together. We found exactly that…
OSAT, advanced packaging, and final test/handler investments.
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