After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process...acute with the adoption of triple-level cell (TLC) NAND, which requires precise threshold-voltage detection....planar scaling increasingly difficult. Column: From 3D NAND to 3D DRAM — how vertical stacking is…
Micron is accelerating its planned 3D-NAND technology roadmap by jumping a generation to provide...G11 technology is the world's most advanced NAND. It will ramp in the second half of next year. Also,...closer to the launch date.” He also discussed…
Business SK hynix looks beyond HBM to tackle AI memory bottlenecks Published: Oct. 14, 2026...expanding its AI memory strategy beyond high-bandwidth memory, developing new technologies to address...moving data across different memory layers, from HBM and conventional DRAM to solid-state drives.
processing cores to off... SK hynix disaggregating SSD controller cores SK hynix is flooding future SDD controllers...The Elec media outlet, Korea’s second memory and NAND supplier is looking at future PCIe speed increases and recognising that a single SSD…
hynix Starts Discussing Mass Production Plans For iHBM Memory Chips That Aim To Improve Heat Resistance By 30%,...which is among the earliest firms to make high-bandwidth memory (HBM), is reportedly consulting supply chain partners for its next-generation HBM memory…
as the sole suppliers of sixth-generation high-bandwidth memory, or HBM4, for Nvidia Corp.'s next flagship AI accelerator,...memory champions a fresh lead over SK Hynix's HBM4 chip (Courtesy of Yonhap) SK Hynix Inc. has proposed...semiconductor architecture that combines high-bandwidth memory…
of AI infrastructure beyond conventional high-bandwidth memory (HBM). The company presented the technologies at the...Kim highlighted progress in High Bandwidth Flash (HBF), a technology aimed at addressing the industry's
across different types of memory, including high-bandwidth memory (HBM), dynamic random-access memory (DRAM) and solid-state drives (SSDs). SK hynix is pursuing...next-generation memory technologies, including 3D stacked DRAM and high-bandwidth flash (HBF), while continuing to enhance the performance of existing HBM…
Samsung appears to have found a way to turn its HBM4 memory shortage into a bargaining chip, and AMD is the one...Seoul on October 7, the stated agenda was high-bandwidth memory. AMD’s Helios rack needs 31TB of HBM4 per system and cannot ship…
Hynix and Micron on one process for its custom NVHBM chips. Samsung agreed after an internal review,...Electronics will make a core part of Nvidia’s custom memory chips on TSMC’s 3-nanometre process. The Seoul Economic...time the two have…
DRAM, HBM and flash: supply, prices, new generations and the makers behind the AI memory squeeze.
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